SILICON WAFERS



BondaTek carries full range of FZ and CZ silicon wafers, the specifications and parameters comply with SEMI standards.

  • Prime, test, mechanic grades
  • Diameter from 2" to 12"
  • Ultra thin or ultra thick
  • Crystalline orientation <100>, <111>, <110>
  • Most resistivity range
  • P type/ Boron, N type/Phos, As doped
  • Heavily doped or intrinsic wafers
  • Single side polished or double sides polished
  • Semi-standard flats or notch point
  • We keep a stock of silicon wafers with various specifications all the time. Contact us for immediate quotation and delivery.




soi wAFERS



Silicon on insulator (SOI) wafers are a three layer material stack composed of the following: an active layer of prime quality silicon (DEVICE LAYER) over a buried layer (BOX) of electrically insulating material (like silicon dioxide, sapphire, silicon nitride, etc), over a bulk silicon support wafer (HANDLE LAYER).





SOI wafers provide a manufacturing solution which helps reduce power and heat while increasing the speed performance of a device. They are widely used for the fabrication of micro electro mechanical system, micro optical devices, sensors, RF switches, power devices, and advanced CMOS IC chips. SOI wafers are unique products which are often custom-built for specific end-user applications.


BondaTek is able to meet customer's needs for SOI wafers with diameter from 76.2mm to 300mm. We accommodate SOI requests for development of small quantities as well as ongoing requirements.



SOLAR WAFER



Material: Monocrystalline Silicon

size: 125mm x 125mm and 156mm x 156mm

Application: Solar System

Packing: Carton

Color: Grey

Advantage: high quality/ short lead time/ low price/ customization
specifications:Conductive Type: N type/ Phos doped

Orientation: <100>=/-3 degree

Resistivity: 1 - 3, 3- 6 ohm.cm

Bulk lifetime: >=1000us

Oxygen Content: <=0.1*10^18cm^3 Carbon Content: <=0.1* 10^17cm^3

Thickness: 200+/-20um TTV: <=25UM Saw Mark:<=15um Warp :<=40um

Chips: Depth <0.3mm, length <0.5mm Less than 2 chips per wafers

Appearance: No stain, No Pinhole and cracks by Visual Inspection Dislocation Density: =1000pcs.cm^2





other wafer services



Wafer Reclaim



  • Wafer Size 100mm - 300mm
  • Metals < 1E10 / CM2
  • TTV < 1um LPD > 32nm
  • Processes Strip & Etch, Lapping, Laser Scribe, Polish,
  • Removable Films:Cu, Ti, Fe, V, TiN, Cr, Al, Ta, SiO, Ti, Zr
  • 100% inspection


Laser Mark



  • Wafer diameters: 50mm to 300mm
  • Customized Character height and width and font.
  • Depth: Soft and hard laser marks available.
  • Soft mark: 1-5μm in depth
  • Hard mark: 5μm to 100μm in depth
  • Mark location: Front or backside
  • Specialty marks: Company logo, etc.


Wafer Dicing



  • Formating Wafers into small Chips Materials: Silicon, Glass, Quartz, Sapphire, etc


our services



Advanced Materials



  • Semiconductor CZ/FZ Si wafer: 4" to 12"
  • Solar wafer
  • Silicon on insulator (SOI) wafer
  • SiO2/LPCVD wafer
  • Glass wafer :Borofloat 33, quartz, soda lime, etc
  • Sputtering targets and evaporation material
  • Chromed photomask blanks: soda lime and quartz
  • Packing boxes for crystal, wafers, filter, chip, etc


Advanced Materials



  • AIIIBV compounds (GaAs, GaP, InP, InAs, etc)
  • Sapphire wafer/ SOS wafer/ AIN-ON-Sapphire wafers
  • Ge wafer/ Ge-on-Silicon / Si-Ge wafers
  • SiC wafer / HPSI SiC Wafer/ SiC epi wafers
  • HEMT GaN wafer/ GaN-on-Sapphire /GaN-on-SiC, GaN-on-Silicon
  • SriTO3 substrate ​/ BaTiO3
  • LiNbO3 / LiTaO3 substrate.
  • MgO, MgF2, BaF2, CaF2 etc.


Professional Services



  • Fabrication of soda lime/quartz photolithographic masks
  • Silicon microfabrication (wet etching, dry etching and wafer bonding)
  • Consultancy of fabrication process Characterization of microdevices/microsystems
  • Consultancy of microfluidics and biological microdevices laser cutting on glass or MEMS and RFID substrates​


CONTACT US:



Headquarter in Singapore:

​BONDA TECHNOLOGY PTE LTD

Address: 10 Anson Road, #10-11 International Plaza S(079903)

Tel: 65-65158750 Fax: 65-67741768

email: sales@bondatek.com


Distributor in China

SIN-BOND HUNAN Science and Technologies Pte Ltd

Address: Room 905 & 906, Science Village South of Yuelushang,

Changsha City, Hu Nan Province P.R of China. 410083

Tel: 86-731-4761739 Fax: 86-731-4761739

email: linhaite@163.com






copyright @2020 Bonda Technology Pte Ltd. all rights reserved