• Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology

Glass Wafers

Stock Code Material Dimension Quantity
GP001 Pyrex 7740 4"x 700um (thickness) 25pcs
GP002 Pyrex 7740 4"x 500um(thickness) 2pcs
GB001 BOROFLOAT33 4"x 2mm (thickness) 25pcs
GI001 ITO 4"x 700um (thickness) with AR COATING 50pcs
GI002 ITO 8mm x 5mm x 2mm (thickness) 20pcs
GQ001 Fused Silica JGS2 4"x 500um (thickness) 25pcs
GQ002 Fused Silica JGS2 4"x 700um (thickness) 25pcs
GQ003 Fused Silica JGS2 20mm x 20mm x 500um (thickness) 50pcs
GU001 UNKHOWN 4" x 500um (thickness) 25pcs
GU002 UNKHOWN 6" x 700um (thickness) 200pcs

MATERIALS

  • Semiconductor Si wafers and Solar wafers
  • Silicon on insulator (SOI) wafers
  • Mask blanks (soda lime and quartz)
  • Glass wafers (Pyrex 7740, quartz, soda lime, etc)
  • AIIIBV compounds (GaAs, GaP, InP, InAs, etc)
  • Sapphire wafers
  • Sputtering targets
  • Thin films-Oxide, nitride
  • Packing boxes for crystal, wafers, filter, chip, etc

SERVICES

  • Fabrication of soda lime/quartz photolithographic masks
  • Silicon microfabrication (wet etching, dry etching and wafer bonding)
  • Consultancy of fabrication process
  • Characterization of microdevices/microsystems
  • Consultancy of microfluidics and biological microdevices



    Service Hotline:
    Tel.: +65-6515 8750
    Fax : +65-6515 8795
    Email: sales@bondatek.com