| Silicon Wafers |
| SOI Wafers |
| Glass Wafers |
| AIIIBV Compounds |
| Sapphire Wafers |
| Thin-film Coated Wafers |
| Sputtering Targets and Evaporation Materials |
| Chrome Mask Blanks |
| Packing Boxes |
Glass Wafers
Stock Code
| Material
| Dimension
| Quantity |
|
| GP001 | Pyrex 7740 | 4"x 700um (thickness) | 25pcs |
| GP002 | Pyrex 7740 | 4"x 500um(thickness) | 2pcs |
| GB001 | BOROFLOAT33 | 4"x 2mm (thickness) | 25pcs |
| GI001 | ITO | 4"x 700um (thickness) with AR COATING | 50pcs |
| GI002 | ITO | 8mm x 5mm x 2mm (thickness) | 20pcs |
| GQ001 | Fused Silica JGS2 | 4"x 500um (thickness) | 25pcs |
| GQ002 | Fused Silica JGS2 | 4"x 700um (thickness) | 25pcs |
| GQ003 | Fused Silica JGS2 | 20mm x 20mm x 500um (thickness) | 50pcs |
| GU001 | UNKHOWN | 4" x 500um (thickness) | 25pcs |
| GU002 | UNKHOWN | 6" x 700um (thickness) | 200pcs |
MATERIALS
- Semiconductor Si wafers and Solar wafers
- Silicon on insulator (SOI) wafers
- Mask blanks (soda lime and quartz)
- Glass wafers (Pyrex 7740, quartz, soda lime, etc)
- AIIIBV compounds (GaAs, GaP, InP, InAs, etc)
- Sapphire wafers
- Sputtering targets
- Thin films-Oxide, nitride
- Packing boxes for crystal, wafers, filter, chip, etc
SERVICES
- Fabrication of soda lime/quartz photolithographic masks
- Silicon microfabrication (wet etching, dry etching and wafer bonding)
- Consultancy of fabrication process
- Characterization of microdevices/microsystems
- Consultancy of microfluidics and biological microdevices
Service Hotline:
Tel.: +65-6515 8750
Fax : +65-6515 8795
Email: sales@bondatek.com