• Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology

Silicon Wafers

Stock Code Diameter Grade Specification Quantity
SI2PSP 50mm Prime P TYPE/BORON/1-20ohm.cm/279um thickness 200pcs
SI2NSP 50mm Prime N type/phos/1-20ohm.cm/279um thickness 100pcs
SI3PSP 76.2mm Test P TYPE/BORON/1-20ohm.cm/381um thickness 100pcs
SI6PSP 100mm Prime P TYPE/BORON/1-20ohm.cm/525um thickness 200pcs
SI2PSP 100mm Prime N type/Phos/1-20ohm.cm/525um thickness 50pcs
SI8PSPD 200mm Dummy P TYPE/BORON/>1ohm.cm/>700umthickness/Coin roll packing 2000pcs

MATERIALS

  • Semiconductor Si wafers and Solar wafers
  • Silicon on insulator (SOI) wafers
  • Mask blanks (soda lime and quartz)
  • Glass wafers (Pyrex 7740, quartz, soda lime, etc)
  • AIIIBV compounds (GaAs, GaP, InP, InAs, etc)
  • Sapphire wafers
  • Sputtering targets
  • Thin films-Oxide, nitride
  • Packing boxes for crystal, wafers, filter, chip, etc
  • Optical component

SERVICES

  • Fabrication of soda lime/quartz photolithographic masks
  • Silicon microfabrication (wet etching, dry etching and wafer bonding)
  • Consultancy of fabrication process
  • Characterization of microdevices/microsystems
  • Consultancy of microfluidics and biological microdevices



    Service Hotline:
    Tel.: +65-6515 8750
    Fax : +65-6515 8795
    Email: sales@bondatek.com