• Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology

Thin-film Coated Wafers

Stock Code Diameter Grade Specification Quantity
SO4 100mm Prime PTYPE / BORON / <100> / 1-20ohm.cm / 525umthick / thermal thickness 2700A 15pcs
SO8 200mm Prime P type /boron / <1-0-0> / 1 to 100ohm.cm / 700-750um / SSP / Thermal thickness 2000nm+/ -5% 50pcs

MATERIALS

  • Semiconductor Si wafers and Solar wafers
  • Silicon on insulator (SOI) wafers
  • Mask blanks (soda lime and quartz)
  • Glass wafers (Pyrex 7740, quartz, soda lime, etc)
  • AIIIBV compounds (GaAs, GaP, InP, InAs, etc)
  • Sapphire wafers
  • Sputtering targets
  • Thin films-Oxide, nitride
  • Packing boxes for crystal, wafers, filter, chip, etc
  • Optical component

SERVICES

  • Fabrication of soda lime/quartz photolithographic masks
  • Silicon microfabrication (wet etching, dry etching and wafer bonding)
  • Consultancy of fabrication process
  • Characterization of microdevices/microsystems
  • Consultancy of microfluidics and biological microdevices



    Service Hotline:
    Tel.: +65-6515 8750
    Fax : +65-6515 8795
    Email: sales@bondatek.com