• Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology

Chrome Mask Blanks

Substrate

  • Soda Lime
  • Quartz

Size

  • 2" to 7" square

Thickness

  • 0.02" to 0.25" (0.5mm to 6mm)

Flatness

  • Quartz: < 5um
  • Soda lime: <6um

Film Specification

CHROMEVacuum Deposited, DC Sputtered in Class 100 Environment
THICKNESS/
OPTICAL DENSITY
Standard: 1000ű 8% / O.D.=3.0±0.2 @ 450nm
Custom Thicknesses up to 5 µm
REFLECTIVITY  CHROME
LOW <12% @ 400nm
MID <33% @400nm
HIGH <55% @400nm
PROCESSEtchable in all conventional Wet Etch systems. Plasma Grade recommended for Dry Etch systems
PHOTORESISTShipley 1800 or AZ 1500 filtered to 0.2 micron at point of use. All widely used positive and negative optical and E-beam resist available

MATERIALS

  • Semiconductor Si wafers and Solar wafers
  • Silicon on insulator (SOI) wafers
  • Mask blanks (soda lime and quartz)
  • Glass wafers (Pyrex 7740, quartz, soda lime, etc)
  • AIIIBV compounds (GaAs, GaP, InP, InAs, etc)
  • Sapphire wafers
  • Sputtering targets
  • Thin films-Oxide, nitride
  • Packing boxes for crystal, wafers, filter, chip, etc
  • Optical component

SERVICES

  • Fabrication of soda lime/quartz photolithographic masks
  • Silicon microfabrication (wet etching, dry etching and wafer bonding)
  • Consultancy of fabrication process
  • Characterization of microdevices/microsystems
  • Consultancy of microfluidics and biological microdevices



    Service Hotline:
    Tel.: +65-6515 8750
    Fax : +65-6515 8795
    Email: sales@bondatek.com