• Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology

Sapphire Wafers

Crystal Materials 99.999%High purity, Monocrystalline Al2O3
Wafer Surface Orientation C-axis [0001] off M [1-100]
0.2°± 0.05°/ 0.3°± 0.1° 0.3° ± 0.25°
Diameter 50.8mm ± 0.1mm / 76.20mm ± 0.25mm/ 100.0 ± 0.40mm
Thickness 500um ± 10um 430um ±10um 330um ± 15um
Major Flat A-axis [11-20] ± 0.5°
Major Flat Length 16.0mm ± 1.0mm / 22.0mm ± 1.0mm / 32.5 ± 1.0mm
Minor None    
Front Surface Finish Epi polished, Ra< 0.20nm
Back Surface SSP: Fine ground, Ra 0.4 to 1.0 um; DSP: Polished
Edge condition Edge defects not to exceed SEMI M3-91
TTV <10um <10um <15um
BOW <10um <10um <15um
Warp <10um <10um <15um
Bubble & Color None by visual inspection in intensive light
Ground Boundary None by visual inspection in fluorescent light
Cleanliness Free visible contamination
Packaging Packaged in a class 100 clean room environment, in cassettes of 25 or single fluroware, under a nitrogen atmosphere

Note: A-plane <1 1 2 0 >, R-plane <1 1 0 2>, and M-plane<1-100> are available; customer's specification not listed above is also available upon request.

MATERIALS

  • Semiconductor Si wafers and Solar wafers
  • Silicon on insulator (SOI) wafers
  • Mask blanks (soda lime and quartz)
  • Glass wafers (Pyrex 7740, quartz, soda lime, etc)
  • AIIIBV compounds (GaAs, GaP, InP, InAs, etc)
  • Sapphire wafers
  • Sputtering targets
  • Thin films-Oxide, nitride
  • Packing boxes for crystal, wafers, filter, chip, etc
  • Optical component

SERVICES

  • Fabrication of soda lime/quartz photolithographic masks
  • Silicon microfabrication (wet etching, dry etching and wafer bonding)
  • Consultancy of fabrication process
  • Characterization of microdevices/microsystems
  • Consultancy of microfluidics and biological microdevices



    Service Hotline:
    Tel.: +65-6515 8750
    Fax : +65-6515 8795
    Email: sales@bondatek.com