• Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology
  • Bonda Technology

Processing Facilities

To form three dimensional mechanical structures (such as channels, diaphragms and cantilevers), microfabrication involves selectively etching of silicon and depositing of thin films with a wide range of processing facilities.

Stepper 5:1, NSR2205i12D
Double Side Mask Aligner 1:1, EVG 620
Mask & Bond Aligner 1:1, MA8/BA6/MA6
E-beam Lithography System, ELS-7000
Optical Laser Writing Tool, DWL2000/66FS

Thin Film Deposition
PECVD System, Nextral ND200
LPCVD System, E1200 HT 260-4
RF/DC Sputtering System, Discovery 18
UBM Sputtering System
E-Beam Evaporator, Auto 306
Thermal Evaporation System, Auto306

Dry Etching
DRIE/ICP Etcher, Plasmalab ICP 180
ICP System, Shuttle Lock Reactor SLR-7701-8R
RIE II Etcher, Plasmalab 80plus
XeF2 Silicon Dry Etching System

Wet Etching
RC Clean wet bench
HF/BOE Processing Hood
KOH/TMAH Processing Hood
Metal etching wet bench

Optical Microscope, BX60
Surface Profiler, P-10

Back-end processing
Dicing system, DAD321
Wire bonding machine, 4524AD
Laser cutter, 5200


  • Semiconductor Si wafers and Solar wafers
  • Silicon on insulator (SOI) wafers
  • Mask blanks (soda lime and quartz)
  • Glass wafers (Pyrex 7740, quartz, soda lime, etc)
  • AIIIBV compounds (GaAs, GaP, InP, InAs, etc)
  • Sapphire wafers
  • Sputtering targets
  • Thin films-Oxide, nitride
  • Packing boxes for crystal, wafers, filter, chip, etc
  • Optical component


  • Fabrication of soda lime/quartz photolithographic masks
  • Silicon microfabrication (wet etching, dry etching and wafer bonding)
  • Consultancy of fabrication process
  • Characterization of microdevices/microsystems
  • Consultancy of microfluidics and biological microdevices

    Service Hotline:
    Tel.: +65-6515 8750
    Fax : +65-6515 8795
    Email: sales@bondatek.com