| Mask Fabrication |
| - Mask Dimensions |
| - Fabrication Process |
| - How to Order |
| Silicon Microfabrication |
| - Capabilities |
| - Facilities |
| One-Stop Services |
Processing Facilities
To form three dimensional mechanical structures (such as channels, diaphragms and cantilevers), microfabrication involves selectively etching of silicon and depositing of thin films with a wide range of processing facilities.
Microlithography
Stepper 5:1, NSR2205i12D
Double Side Mask Aligner 1:1, EVG 620
Mask & Bond Aligner 1:1, MA8/BA6/MA6
E-beam Lithography System, ELS-7000
Optical Laser Writing Tool, DWL2000/66FS
Thin Film Deposition
PECVD System, Nextral ND200
LPCVD System, E1200 HT 260-4
RF/DC Sputtering System, Discovery 18
UBM Sputtering System
E-Beam Evaporator, Auto 306
Thermal Evaporation System, Auto306
Dry Etching
DRIE/ICP Etcher, Plasmalab ICP 180
ICP System, Shuttle Lock Reactor SLR-7701-8R
RIE II Etcher, Plasmalab 80plus
XeF2 Silicon Dry Etching System
Wet Etching
RC Clean wet bench
HF/BOE Processing Hood
KOH/TMAH Processing Hood
Metal etching wet bench
Metrology/Characterization
Optical Microscope, BX60
Surface Profiler, P-10
Elipsometer
Back-end processing
Dicing system, DAD321
Wire bonding machine, 4524AD
Laser cutter, 5200
MATERIALS
- Semiconductor Si wafers and Solar wafers
- Silicon on insulator (SOI) wafers
- Mask blanks (soda lime and quartz)
- Glass wafers (Pyrex 7740, quartz, soda lime, etc)
- AIIIBV compounds (GaAs, GaP, InP, InAs, etc)
- Sapphire wafers
- Sputtering targets
- Thin films-Oxide, nitride
- Packing boxes for crystal, wafers, filter, chip, etc
- Optical component
SERVICES
- Fabrication of soda lime/quartz photolithographic masks
- Silicon microfabrication (wet etching, dry etching and wafer bonding)
- Consultancy of fabrication process
- Characterization of microdevices/microsystems
- Consultancy of microfluidics and biological microdevices
Service Hotline:
Tel.: +65-6515 8750
Fax : +65-6515 8795
Email: sales@bondatek.com